Cover Image

Simulation of an electrolytic bath for electrodeposition of multilayer shielding coatings

E. A. Dolmatova, A. D. Dayanov, T. N. Ostanina

Abstract


In the work galvanic bath of Cu/(Ni+Cu) multilayer shielding coatings formation from an acetate electrolyte containing 0,03 mol/L of CuAc2, 0,3 mol/L of NiAc2 and 1,66 mol/L of acetic acid. According to the results of polarization studies values of coatings deposition pulse mode current density have been chosen and current efficiency of copper and nickel during deposition of Cu-Ni alloy has been determined. To ensure a constant formulation of the electrolyte it has been proposed to use insoluble anodes made of stainless steel and continuous circulation of the electrolyte. The scheme of steams enabling the adjustment of the solution formulation with the use of an additional collecting vessel has been developed. The formulation of the correcting stream continuously fed into the collecting vessel has been calculated.

Keywords


electrochemistry; simulation; copper acetate; nickel acetate; multilayer shielding coating

Full Text:

PDF

References


Rudoi VM, Ostanina TN, Darintseva AB, Ostanin NI, Alikhanova IA, Demakov SL, Prokof'eva AS. Electrodeposition of copper on metal-filled composite support. Russ J Electrochem. 2010;46(6):702–6. doi:10.1134/S1023193510060157

Ovchnnikova SN, Poddubnyi NP, Masliy AI, Boldyrev VV. Schwazacher W. Mutual influence of electrode processes during electrodeposition of layered structures by the single-bath method: The effect of nickel deposition and hydrogen evolution on the transport of copper ions in acetate and sulfamate electrolytes. Russ J Electrochem. 2002;38(11):1210–16. doi:10.1023/A:1021153827310




DOI: http://dx.doi.org/10.15826/chimtech.2015.2.3.021

Copyright (c) 2015 E. A. Dolmatova, A. D. Dayanov, T. N. Ostanina

© Chimica Techno Acta, 2014-2019
ISSN 2411-1414 (Online), ISSN 2409-5613 (Print)

ROAD logo WorldCat logo DOAJ logo CAS logo BASE logo eLibrary logo